{
  "version": "https://jsonfeed.org/version/1.1",
  "title": "Qualcomm Multiple Chipsets: 4 exploited vulnerabilities · updates",
  "home_page_url": "https://pwn.watch/i/qualcomm-multiple-chipsets-cve-2022-22071-and-3-more",
  "feed_url": "https://pwn.watch/i/qualcomm-multiple-chipsets-cve-2022-22071-and-3-more/feed.json",
  "description": "Multiple Qualcomm chipsets contain a use-after-free vulnerability when process shell memory is freed using IOCTL munmap call and process initialization is in progress. Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP. Multiple Qualcomm chipsets contain a use of out-of-range pointer offset vulnerability due to memory corruption in Graphics while submitting a large list of sync points in an AUX command to the IOCTL_KGSL_GPU_AUX_COMMAND. Multiple Qualcomm chipsets contain an integer overflow vulnerability due to memory corruption in Graphics Linux while assigning shared virtual memory region during IOCTL call. Added to CISA KEV on 2023-12-05.",
  "language": "en",
  "_pwn": {
    "slug": "qualcomm-multiple-chipsets-cve-2022-22071-and-3-more",
    "severity": "high",
    "status": "closed",
    "patchStatus": "patched",
    "rss": "https://pwn.watch/i/qualcomm-multiple-chipsets-cve-2022-22071-and-3-more/feed.xml",
    "llms": "https://pwn.watch/i/qualcomm-multiple-chipsets-cve-2022-22071-and-3-more/llms.txt",
    "json": "https://pwn.watch/i/qualcomm-multiple-chipsets-cve-2022-22071-and-3-more.json"
  },
  "items": [
    {
      "id": "https://pwn.watch/i/qualcomm-multiple-chipsets-cve-2022-22071-and-3-more#2023-12-05-26f08c08",
      "url": "https://pwn.watch/i/qualcomm-multiple-chipsets-cve-2022-22071-and-3-more#2023-12-05-26f08c08",
      "title": "Qualcomm Multiple Chipsets: 4 exploited vulnerabilities: CISA added CVE-2022-22071 to the KEV catalog (due 2023-12-26).",
      "content_text": "Qualcomm Multiple Chipsets: 4 exploited vulnerabilities: CISA added CVE-2022-22071 to the KEV catalog (due 2023-12-26).",
      "date_published": "2023-12-05T00:00:00.000Z",
      "tags": [
        "high"
      ]
    },
    {
      "id": "https://pwn.watch/i/qualcomm-multiple-chipsets-cve-2022-22071-and-3-more#2023-12-05-e92eeac2",
      "url": "https://pwn.watch/i/qualcomm-multiple-chipsets-cve-2022-22071-and-3-more#2023-12-05-e92eeac2",
      "title": "Qualcomm Multiple Chipsets: 4 exploited vulnerabilities: CISA added CVE-2023-33063 to the KEV catalog (due 2023-12-26).",
      "content_text": "Qualcomm Multiple Chipsets: 4 exploited vulnerabilities: CISA added CVE-2023-33063 to the KEV catalog (due 2023-12-26).",
      "date_published": "2023-12-05T00:00:00.000Z",
      "tags": [
        "high"
      ]
    },
    {
      "id": "https://pwn.watch/i/qualcomm-multiple-chipsets-cve-2022-22071-and-3-more#2023-12-05-3dc52f0c",
      "url": "https://pwn.watch/i/qualcomm-multiple-chipsets-cve-2022-22071-and-3-more#2023-12-05-3dc52f0c",
      "title": "Qualcomm Multiple Chipsets: 4 exploited vulnerabilities: CISA added CVE-2023-33106 to the KEV catalog (due 2023-12-26).",
      "content_text": "Qualcomm Multiple Chipsets: 4 exploited vulnerabilities: CISA added CVE-2023-33106 to the KEV catalog (due 2023-12-26).",
      "date_published": "2023-12-05T00:00:00.000Z",
      "tags": [
        "high"
      ]
    },
    {
      "id": "https://pwn.watch/i/qualcomm-multiple-chipsets-cve-2022-22071-and-3-more#2023-12-05-892ebd89",
      "url": "https://pwn.watch/i/qualcomm-multiple-chipsets-cve-2022-22071-and-3-more#2023-12-05-892ebd89",
      "title": "Qualcomm Multiple Chipsets: 4 exploited vulnerabilities: CISA added CVE-2023-33107 to the KEV catalog (due 2023-12-26).",
      "content_text": "Qualcomm Multiple Chipsets: 4 exploited vulnerabilities: CISA added CVE-2023-33107 to the KEV catalog (due 2023-12-26).",
      "date_published": "2023-12-05T00:00:00.000Z",
      "tags": [
        "high"
      ]
    }
  ]
}